Method of producing abrasive particle mixture composition, abrasive particle mixture composition, polishing pad using the same, method for producing polishing pad and chemical mechanical polishing method

摘要

PROBLEM TO BE SOLVED: To reduce the amount of slurry needed to polish an inter-layer insulating film formed on a semiconductor board.;SOLUTION: A compound impregnated with encapsulated abrasive particles 15 is applied to the surface of an abrasive pad. Specifically, the abrasive articles 15 are encapsulated with a first binder 12, which is selected as a binder soluble to an etchant, to make abrasive particles 11, which are then impregnated into a second binder 13 to make an abrasive layer 10. Upon polishing the inter-layer insulating film, the first binder 12 is dissolved into the etchant, which guides the abrasive particles 11 to the inter-layer insulating film.;COPYRIGHT: (C)2003,JPO