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Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type

机译:用于流体应用的传感器芯片卡中安装的芯片模块及其制造方法

摘要

A plate-shaped chip supporting body has a number of write/read contacts for exchanging data with an external chip card. A number of corresponding terminal panels which are electrically connected to the write/read contacts of the front flat side, are arranged on the opposite rear side of the chip supporting body. A sensor ship is attached to the rear side of the chip supporting body and has contact pads electrically connected to the terminal panels of the chip supporting body. Contact panels on the flat side of the sensor chip are oriented toward the chip supporting body and are connected to the pad contact, which are located on the opposite flat side of the sensor chip, by at least one electrical signal line path passing through the sensor chip, and the contact panels are connected to the terminal panels of the chip supporting body by electrically conductive material.
机译:板状芯片支撑体具有多个用于与外部芯片卡交换数据的写/读触点。电连接到前平坦侧的写/读触点的多个相应的端子面板布置在芯片支撑体的相对的后侧上。传感器船被附接到芯片支撑体的后侧并且具有电连接到芯片支撑体的端子板的接触垫。传感器芯片平面侧的接触板朝向芯片支撑体,并通过至少一条穿过传感器的电信号线路径连接到位于传感器芯片相对平面侧的焊盘触点芯片,并且接触面板通过导电材料连接到芯片支撑体的端子面板。

著录项

  • 公开/公告号US2010096708A1

    专利类型

  • 公开/公告日2010-04-22

    原文格式PDF

  • 申请/专利权人 GERALD ECKSTEIN;

    申请/专利号US20060989939

  • 发明设计人 GERALD ECKSTEIN;

    申请日2006-06-21

  • 分类号H01L23/48;H01L21/50;

  • 国家 US

  • 入库时间 2022-08-21 18:55:31

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