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Chip module for installation in sensor chip cards for fluidic applications and method for producing such a chip module
Chip module for installation in sensor chip cards for fluidic applications and method for producing such a chip module
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机译:用于流体应用的传感器芯片卡中安装的芯片模块及其制造方法
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摘要
It becomes a chip module for installation in sensor chip cards for fluidic applications, consisting of a plate-shaped chip carrier body, on the front flat side of which is directed toward the outside of the sensor chip card, a plurality of read / write contacts for data exchange with external chip card readers and on the opposite rear side a plurality of corresponding ones the write / read contacts on the front flat side are arranged, and a sensor chip is attached to the back of the chip carrier body, which has contact pads that are electrically connected to the terminal fields of the chip carrier body, in which, according to the invention, the chip carrier body (1) Directional flat side of the sensor chip (2) are arranged contact fields (8) which lead with the pad contacts (4) located on the opposite flat side of the sensor chip, each by means of at least one through the sensor chip (2) nden electrical signal line (7) are connected, and that the contact fields (8) are connected to the connection fields (6) of the chip carrier body (1) by means of electrically conductive material. DOLLAR A In addition, a method for producing such a chip module is presented.
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