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Chip module for installation in sensor chip cards for fluidic applications and method for producing such a chip module

机译:用于流体应用的传感器芯片卡中安装的芯片模块及其制造方法

摘要

It becomes a chip module for installation in sensor chip cards for fluidic applications, consisting of a plate-shaped chip carrier body, on the front flat side of which is directed toward the outside of the sensor chip card, a plurality of read / write contacts for data exchange with external chip card readers and on the opposite rear side a plurality of corresponding ones the write / read contacts on the front flat side are arranged, and a sensor chip is attached to the back of the chip carrier body, which has contact pads that are electrically connected to the terminal fields of the chip carrier body, in which, according to the invention, the chip carrier body (1) Directional flat side of the sensor chip (2) are arranged contact fields (8) which lead with the pad contacts (4) located on the opposite flat side of the sensor chip, each by means of at least one through the sensor chip (2) nden electrical signal line (7) are connected, and that the contact fields (8) are connected to the connection fields (6) of the chip carrier body (1) by means of electrically conductive material. DOLLAR A In addition, a method for producing such a chip module is presented.
机译:它成为一个安装在用于流体应用的传感器芯片卡中的芯片模块,该模块由板状芯片载体主体组成,该芯片状载体的前平侧面指向传感器芯片卡的外部,并具有多个读/写触点为了与外部芯片卡读卡器进行数据交换,在相对的后侧,多个相对应的前/后侧安排了写/读触点,并且在芯片载体的背面安装了传感器芯片,该传感器芯片具有触点电连接到芯片载体主体的端子区的焊盘,其中,根据本发明,在芯片载体主体(1)的传感器芯片(2)的定向平坦侧上布置有接触场(8),其与位于传感器芯片相对的平坦侧上的焊盘触点(4),分别通过至少一个穿过传感器芯片(2)的电信号线(7)连接,并且触点区域(8)连接到芯片载体(1)的连接区域(6)借助于导电材料。美元A此外,提出了一种用于生产这种芯片模块的方法。

著录项

  • 公开/公告号DE102005036824A1

    专利类型

  • 公开/公告日2007-03-29

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE20051036824

  • 发明设计人

    申请日2005-08-04

  • 分类号H01L49/02;G06K19/077;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:51

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