A testing apparatus for testing of integrated circuit devices at elevated temperatures comprises hot belt 111 is operable to transport integrated circuits from a main production line into a hot chamber 121 and thence onto a test area 122 within the hot chamber 121 and a cold belt 112 operable to receive integrated circuits from the test area 122 and transport them back to the main production line. Both the hot and cold belts 111, 112 are indexed stepwise, the indexing distance being equal to the separation of the pockets provided for receiving integrated circuits. In the test area 122 are four vacuum chucks 131a-131d each operable to pick an integrated circuit from adjacent pockets on the hot belt 111 and place it on corresponding test heads 133a-133d (via a corresponding repositioning means 132a-132d) for diagnostic testing at an elevated temperature. After testing, the vacuum chucks 131a-131d are operable to pick the integrated circuits from the corresponding test heads 133a-133d and place them in adjacent pockets on the cold belt 112. 展开▼
机译:一种用于在高温下测试集成电路器件的测试设备,包括热带 111 B>,可用于将集成电路从主生产线传输到热室 121 B>中,然后传输到热室中。热室 121 B>中的测试区域 122 B>和冷带 112 B>内的操作区域可从测试区域 122 B >并将它们运回主要生产线。热带和冷带 111、112 B>均分步进行分度,分度距离等于用于容纳集成电路的口袋的间距。在测试区域 122 B>中有四个真空吸盘 131 B> a I>- 131 B> d I>可从热带 111 B>上相邻口袋中拾取集成电路并将其放在相应的测试头 133 B> a I>- 133 < / B> d I>(通过相应的重新定位装置 132 B> a I>- 132 B> d I> )进行高温诊断测试。测试后,真空吸盘 131 B> a I>- 131 B> d I>可操作以从相应的测试中选择集成电路头 133 B> a I>- 133 B> d I>放置在冷带 112上的相邻口袋中。 B>
展开▼