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Using Electric-Field Directed Post-Exposure Bake for Double-Patterning (D-P)
Using Electric-Field Directed Post-Exposure Bake for Double-Patterning (D-P)
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机译:使用电场定向曝光后烘烤进行双模式(D-P)
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摘要
The invention provides a method of processing a substrate using Double-Patterning (D-P) processing sequences and Electric-Field Enhanced Layers (E-FELs). The D-P processing sequences and E-FELs can be used to create lines, trenches, vias, spacers, contacts, and gate structures using a minimum number of etch processes.
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