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USING ELECTRIC-FIELD DIRECTED POST-EXPOSURE BAKE FOR DOUBLE PATTERNING (D-P)
USING ELECTRIC-FIELD DIRECTED POST-EXPOSURE BAKE FOR DOUBLE PATTERNING (D-P)
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机译:使用电子方向曝光后烘烤进行双图案(D-P)
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摘要
The invention provides a method of processing a substrate using Double-Patterning (D-P) processing sequences and Electric-Field Enhanced Layers (E-FELs). The D-P processing sequences and E-FELs can be used to create lines, trenches, vias, spacers, contacts, and gate structures using a minimum number of etch processes.
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