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INTEGRATED TRENCH MOSFET AND JUNCTION BARRIER SCHOTTKY RECTIFIER WITH TRENCH CONTACT STRUCTURES

机译:带有沟槽接触结构的集成沟槽MOSFET和结型势垒肖特基整流器

摘要

A trench MOSFET in parallel with trench junction barrier Schottky rectifier with trench contact structures is formed in single chip. The present invention solves the drawback brought by some prior arts, for example, the large area occupied by planar contact structure and high gate-source capacitance. As the electronic devices become more miniaturized, the trench contact structures of this invention are able to be shrunk to achieve low specific on-resistance of Trench MOSFET, and low Vf and reverse leakage current of the Schottky Rectifier.
机译:在单个芯片中形成与具有沟槽接触结构的沟槽结势垒肖特基整流器并联的沟槽MOSFET。本发明解决了一些现有技术带来的缺点,例如,平面接触结构所占面积大,栅-源电容高。随着电子设备变得更加小型化,本发明的沟槽接触结构能够缩小以实现沟槽式MOSFET的低比导通电阻以及肖特基整流器的低Vf和反向漏电流。

著录项

  • 公开/公告号US2009315107A1

    专利类型

  • 公开/公告日2009-12-24

    原文格式PDF

  • 申请/专利权人 FU-YUAN HSIEH;

    申请/专利号US20080213629

  • 发明设计人 FU-YUAN HSIEH;

    申请日2008-06-23

  • 分类号H01L27/06;

  • 国家 US

  • 入库时间 2022-08-21 18:53:29

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