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Method for inhibiting electromigration-induced phase segregation in solder joints
Method for inhibiting electromigration-induced phase segregation in solder joints
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机译:抑制焊点中电迁移引起的相分离的方法
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摘要
A method for inhibiting electromigration-induced phase segregation suitable for solder joint configurations used in a chip package is described as following. First, a chip package including a wiring board, a chip and numbers of solder joints is provided, wherein the chip is disposed on the wiring board, and the solder joints are disposed between the chip and the wiring board to electrically connect the chip to the wiring board. Next, a first current and a second current are alternately applied to a side of the solder joints, wherein flowing directions of the first current and the second current are opposite. The current density of the first current is 103˜105 A/cm2, and the current density of the second current is 103˜105 A/cm2.
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机译:以下描述了一种适合于芯片封装中使用的适于焊接接头构造的抑制电迁移引起的相偏析的方法。首先,提供一种包括布线板,芯片和多个焊点的芯片封装,其中,将芯片设置在布线板上,并且将焊点设置在芯片和布线板之间,以将芯片电连接至芯片。接线板。接下来,将第一电流和第二电流交替地施加到焊点的一侧,其中第一电流和第二电流的流动方向相反。第一电流的电流密度为10 3 Sup>〜10 5 Sup> A / cm 2 Sup>,第二电流的电流密度为10 < Sup> 3 Sup>〜10 5 Sup> A / cm 2 Sup>。
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