The invention relates to a microfabricated capacitive ultrasonic transducer (20) comprising at least one thin plate (21), provided with a metallization (24), suspended over a conductive substrate (23) through supporting elements integrally coupled to the conductive substrate (23), the conductive substrate (23) forming one or more electrodes corresponding to said at least one thin plate (21), characterized in that said supporting elements comprise an ordered arrangement of columns or “pillars” (22) to which the thin plate (21) is integrally coupled, whereby the pillars (22) operate as substantially punctiform constraints. The invention further relates to a surface micro-mechanical process for fabricating such microfabricated capacitive ultrasonic transducers (20).
展开▼