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Fully tested wafers having bond pads undamaged by probing and applications thereof
Fully tested wafers having bond pads undamaged by probing and applications thereof
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机译:经过充分测试的晶圆,其键合焊盘不会因探测和应用而损坏
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摘要
Methods and apparatus for producing fully tested unsingulated integrated circuits without probe scrub damage to bond pads includes forming a wafer/wafer translator pair removably attached to each other wherein the wafer translator includes contact structures formed from a soft crushable electrically conductive material and these contact structures are brought into contact with the bond pads in the presence of an inert gas; and subsequently a vacuum is drawn between the wafer and the wafer translator. In one aspect of the present invention, the unsingulated integrated circuits are exercised by a plurality of test systems wherein the bond pads are never physically touched by the test system and electrical access to the wafer is only provided through the inquiry-side of the wafer translator. In a further aspect of the present invention, known good die having bond pads without probe scrub marks are provided for incorporation into products.
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