Dual MOSFET package

摘要

A semiconductor device package comprises a first semiconductor die having a first source region, a first gate region, and a first drain region attached on a first leadframe, a second semiconductor die having a second source region, a second gate region, and a second drain region attached on a second leadframe, and several pins electrically connected to the leadframes and source and gate regions. The second leadframe is electrically connected to the first source region. The pins connected to the first leadframe and second source region are on a side of the package, and the pins connected to the first gate region, second leadframe, and second gate region are on another side of the package.