首页>
外国专利>
Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
展开▼
机译:具有互连3D层压板的垂直封装IC器件模块直接接触晶圆背面
展开▼
页面导航
摘要
著录项
相似文献
摘要
An electronic package for containing at least a top packaging module vertically stacked on a bottom packaging module. Each of the packaging modules includes a semiconductor chip packaged and connected by via connectors and connectors disposed on a laminated board fabricated with a standard printed-circuit board process wherein the top and bottom packaging module further configured as a surface mountable modules for conveniently stacking and mounting to prearranged electrical contacts without using a leadframe. At least one of the top and bottom packaging modules is a multi-chip module (MCM) containing at least two semiconductor chips. At least one of the top and bottom packaging modules includes a ball grid array (BGA) for surface mounting onto the prearranged electrical contacts. At least one of the top and bottom packaging modules includes a plurality of solder bumps on one of the semiconductor chips for surface mounting onto the prearranged electrical contacts. The laminated board of the bottom packaging modules further has a thermal expansion coefficient substantially the same as a printed circuit board (PCB) whereby a surface mount onto the PCB is less impacted by a temperature change.
展开▼