首页> 外国专利> Substrate processing system for setting uniform module cycle length and access control time lag in two pipeline processing systems

Substrate processing system for setting uniform module cycle length and access control time lag in two pipeline processing systems

机译:用于在两个管道处理系统中设置均匀模块周期长度和访问控制时滞的基板处理系统

摘要

In a substrate processing system according to the present invention, module cycle periods at a plurality of process modules PM1 through PM4 connected around a transfer module TM having installed therein a vacuum pressure-side transfer robot RB1, each representing the sum of a wafer stay time including the wafer processing time and an attendant busy time during which the wafer is transferred before and after the wafer stay time, are all set to a uniform length. The vacuum pressure-side transfer robot RB1 takes out a processed wafer Wi and carries a next wafer Wi+1 to be processed next by executing a pick and place operation for each of the process modules PM1 through PM4 during a single access to the process module.
机译:在根据本发明的基板处理系统中,围绕在其中安装有真空的传送模块TM周围连接的多个处理模块PM 1 至PM 4 的模块循环周期压力侧传送机械手RB 1 分别代表包括晶片处理时间在内的晶片停留时间之和和晶片停留时间之前和之后转移晶片所伴随的繁忙时间之和。设置为统一的长度。真空压力侧传送机械手RB 1 取出已处理的晶片W i 并携带下一个要处理的晶片W i + 1 通过在对过程模块的单次访问期间对每个过程模块PM 1 到PM 4 执行拾取和放置操作。

著录项

  • 公开/公告号US7630785B2

    专利类型

  • 公开/公告日2009-12-08

    原文格式PDF

  • 申请/专利权人 GAKU IKEDA;

    申请/专利号US20050300309

  • 发明设计人 GAKU IKEDA;

    申请日2005-12-15

  • 分类号G06F19;

  • 国家 US

  • 入库时间 2022-08-21 18:47:39

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