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METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMICONDUCTOR MANUFACTURING
METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMICONDUCTOR MANUFACTURING
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机译:半导体制造中基体边和边缘抛光的低成本,高性能抛光带的方法和装置
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摘要
Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device includes a base having a first surface; a resin layer adhering to the first surface of the base; and a plurality of abrasive beads affixed to the first surface by the resin layer, the plurality of abrasive beads comprising a plurality of abrasive particles suspended in binder material; wherein the plurality of abrasive beads and the resin layer comprise an abrasive side of the polishing device adapted to contact the substrate. Numerous other aspects are provided.
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