SILICON CONDENSER MICROPHONE AND MANUFACTURING METHOD OF SILICON CHIP THEREOF

摘要

PURPOSE: a kind of silicon condenser microphone and the silicon wafer of manufacturing method are provided identical, to obtain good sound quality, by regularly keeping sensitivity compared to ECM (microphone) or the microelectromechanicpositioning MEMS (system) of electric condenser. ;CONSTITUTION: external connection terminals are formed in bottom PCB (110). Silicon chip (120) couples the top surface of PCB. Silicon wafer includes on the top formation silicon substrate of silicon substrate (122) and conductive layer (124). Amplifying unit (150) couples the top surface of PCB. The installation of the metal material (140) of vibrating membrane is the silicon wafer by being inserted on the top of insulation spacer (130). Acoustic pressure is applied to sound case (160). Shell covers silicon wafer, which shakes film. The shell is connected to PCB. ;The 2010 of copyright KIPO submissions