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PROTECTIVE LAYER TO ENABLE DAMAGE FREE GAP FILL, CAPABLE OF FORMING A DIELECTRIC LAYER ON A SUBSTRATE WITH HIGH DENSITY AND AN ISOLATED AREA
PROTECTIVE LAYER TO ENABLE DAMAGE FREE GAP FILL, CAPABLE OF FORMING A DIELECTRIC LAYER ON A SUBSTRATE WITH HIGH DENSITY AND AN ISOLATED AREA
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机译:保护层可实现无损伤的间隙填充,并能够在高密度且隔离区域大的基材上形成介电层
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摘要
PURPOSE: A protective layer to enable damage free gap fill is provided to perform fill so that a void or a weak area is not left unfilled without damage to a specific part.;CONSTITUTION: A protective layer to enable damage free gap fill is comprised of the steps: proving some specific part with higher density than others and some specific part with lower density than others on a substrate(301); depositing a protective layer on a specific part(303); depositing a dielectric layer to partially fill a gap of a high aspect ratio(305); and etching a substrate to remove a deposition material from to decrease aspect ratio of the gap at the specific part with a high density.;COPYRIGHT KIPO 2010
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