首页> 外国专利> PROTECTIVE LAYER TO ENABLE DAMAGE FREE GAP FILL, CAPABLE OF FORMING A DIELECTRIC LAYER ON A SUBSTRATE WITH HIGH DENSITY AND AN ISOLATED AREA

PROTECTIVE LAYER TO ENABLE DAMAGE FREE GAP FILL, CAPABLE OF FORMING A DIELECTRIC LAYER ON A SUBSTRATE WITH HIGH DENSITY AND AN ISOLATED AREA

机译:保护层可实现无损伤的间隙填充,并能够在高密度且隔离区域大的基材上形成介电层

摘要

PURPOSE: A protective layer to enable damage free gap fill is provided to perform fill so that a void or a weak area is not left unfilled without damage to a specific part.;CONSTITUTION: A protective layer to enable damage free gap fill is comprised of the steps: proving some specific part with higher density than others and some specific part with lower density than others on a substrate(301); depositing a protective layer on a specific part(303); depositing a dielectric layer to partially fill a gap of a high aspect ratio(305); and etching a substrate to remove a deposition material from to decrease aspect ratio of the gap at the specific part with a high density.;COPYRIGHT KIPO 2010
机译:目的:提供能够实现无损伤间隙填充的保护层来执行填充,以便在不损坏特定部分的情况下不遗留空隙或薄弱区域。组成:能够实现无损伤间隙填充的保护层包括:步骤:在衬底上证明某些特定部分的密度比其他部分高,而某些特定部分的密度比其他部分低(301);在特定部分上沉积保护层(303);沉积介电层以部分填充高纵横比的间隙(305);蚀刻衬底以去除沉积材料,从而以高密度减小特定部分的间隙的纵横比。; COPYRIGHT KIPO 2010

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