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CHIP ON GLASS PANEL SYSTEM CONFIGURATION, CAPABLE OF MINIMIZING A BLOCK DIM IN CONSIDERATION OF A CORRELATION BETWEEN CHIPS
CHIP ON GLASS PANEL SYSTEM CONFIGURATION, CAPABLE OF MINIMIZING A BLOCK DIM IN CONSIDERATION OF A CORRELATION BETWEEN CHIPS
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机译:玻璃板上的芯片配置,考虑到芯片之间的相互关系,可以最小化块的尺寸
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摘要
PURPOSE: A chip on glass panel system configuration is provided to minimize a block dim generated on an LCD panel by including a plurality of SDICs and at least one resistor for compensating a block dim.;CONSTITUTION: A COG panel system configuration(200) includes an FPC, an SDI, and a block compensation resistor. An FPC(230) supplies power having at least two fixed voltage levels. The plural SDI(210, 220)s receives by-pass power supplied from the FPC commonly. The plural SDI is generated by diving LCD driving signals which are consecutive and required for any line of the LCD. A compensation power supply distinguished from the by-pass power from FPC is applied to a corresponding SDI through at least block dim compensation resistor.;COPYRIGHT KIPO 2010
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