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CHIP ON GLASS PANEL SYSTEM CONFIGURATION, CAPABLE OF MINIMIZING A BLOCK DIM IN CONSIDERATION OF A CORRELATION BETWEEN CHIPS

机译:玻璃板上的芯片配置,考虑到芯片之间的相互关系,可以最小化块的尺寸

摘要

PURPOSE: A chip on glass panel system configuration is provided to minimize a block dim generated on an LCD panel by including a plurality of SDICs and at least one resistor for compensating a block dim.;CONSTITUTION: A COG panel system configuration(200) includes an FPC, an SDI, and a block compensation resistor. An FPC(230) supplies power having at least two fixed voltage levels. The plural SDI(210, 220)s receives by-pass power supplied from the FPC commonly. The plural SDI is generated by diving LCD driving signals which are consecutive and required for any line of the LCD. A compensation power supply distinguished from the by-pass power from FPC is applied to a corresponding SDI through at least block dim compensation resistor.;COPYRIGHT KIPO 2010
机译:目的:提供一种玻璃板上芯片系统配置,以通过包括多个SDIC和至少一个电阻来补偿块暗度,从而最小化LCD面板上产生的块暗度。组成:一种COG面板系统配置(200)包括FPC,SDI和块补偿电阻。 FPC(230)提供具有至少两个固定电压电平的功率。多个SDI(210、220)共同接收从FPC提供的旁路功率。通过对连续的LCD驱动信号进行连续的潜水LCD驱动信号来生成多个SDI。通过至少一个暗淡的补偿电阻将与FPC的旁路电源区分开的补偿电源施加到相应的SDI。COPYRIGHTKIPO 2010

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