APPARATUS FOR BONDING CHIP OR FILM ON GLASS AND METHOD FOR BONDING CHIP OR FILM ON GLASS USING THE SAME

摘要

PURPOSE: A PCB bonding device for arraying a PCB and a base substrate and a PCB bonding method using the same are provided to reduce a manufacturing time in a bonding process by completing the array of the PCB and the base substrate and recognize the arrangement mark of the PCB. CONSTITUTION: An absorbing body(110) adsorbs a PCB(Printed Circuit Board). A substrate support(120) supports a base substrate. A first optical unit is arranged between the absorbing body and substrate support of the initial position in the lower of the absorbing body. The arrangement mark of PCB takes a picture. A second optical unit is arranged in the lower of the substrate support. The alignment mark of the base substrate takes a picture.