ULTRASONIC AND THERMO-COMPRESSIVE CHIP-ON-GLASS BONDER OF ANISOTROPIC CONDUCTION FILMS

摘要

PURPOSE: An ultrasonic and thermo-compressive chip-on-glass bonder of anisotropic conduction films is provided to remarkably shorten an interval of bonding time and to guarantee reliability, by using a surface-melting/adhesion of metal balls by ultrasonic so that an electrical ohmic contact characteristic and a mechanical delamination phenomenon are improved. CONSTITUTION: Anisotropic conduction films wound around a reel are attached to liquid-crystal-display(LCD) glass lead frame. Semiconductor chips are aligned on the anisotropic conduction films. The attached chip is thermo-compressed to harden thermo setting plastic. The metal balls inside the anisotropic conduction films are melted and adhered to the surface of both pads.