A chip part having a tin plating solution, tin plating method using a plating solution that tin, tin plating and tin plating layer formed adjustment method using the tin plating solution

摘要

An object of the present invention is the provision of long tin plating solution is remarkably difficult to cause generation of a sludge even long-term storage, the solution life. The invention provides a tin plating solution for carrying out the tin plating by electrolysis, tin ion supply source to stabilize the tin salt as tin terms containing 5g / L ~ 30g / L, and screen chelate the tin ions to achieve the above objective which it is characterized in that it comprises a chelating agent and a pH adjusting agent. Then, the method of adjusting the tin plating solution is characterized in by the addition of methane sulfonic acid in a solution of neutral to alkaline tin to form a tin chelate complex. ; Tin plating sludge