UNIT FOR CONTROLLING MAGNETIC FIELD FORMING AND A MAGNETRON SPUTTERING APPARATUS AND A MAGNETRON SPUTTERING METHOD USING THE SAME, CAPABLE OF PERFORMING UNIFORM DEGREE OF DEPOSITION

摘要

PURPOSE: A unit for controlling magnetic field forming and a magnetron sputtering apparatus and a magnetron sputtering method using the same are provided to prevent the magnetization of a target after supporting process.;CONSTITUTION: A magnetron sputtering apparatus comprises a processing chamber(100), a target(200), a magnetic field forming unit(400), a process control unit(500), and a controller for magnetic field forming unit(600). The magnetic field form unit supplies constant magnetic field to target. The target is formed with a magnetic body. The target is deposited on the substrate. A controller for magnetic field forming unit receives an electrical signal from the outside.;COPYRIGHT KIPO 2010