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METHOD FOR CLEANING SEMICONDUCTOR WAFER SURFACES BY APPLYING PERIODIC SHEAR STRESS TO THE CLEANING SOLUTION
METHOD FOR CLEANING SEMICONDUCTOR WAFER SURFACES BY APPLYING PERIODIC SHEAR STRESS TO THE CLEANING SOLUTION
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机译:通过将周期剪切应力应用于清洗溶液来清洗半导体晶片表面的方法
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摘要
Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is applied over a wafer surface. External energy is applied to the cleaning media to generate periodic shear stresses within the media. The periodic shear stresses impart momentum and/or drag forces on the coupling elements causing the coupling elements to interact with the particulate contaminants to remove the particulate contaminants from the wafer surfaces.;COPYRIGHT KIPO & WIPO 2010
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