METHOD FOR CLEANING SEMICONDUCTOR WAFER SURFACES BY APPLYING PERIODIC SHEAR STRESS TO THE CLEANING SOLUTION

摘要

is a system and method for cleaning the particle contaminants attached to the wafer surface is provided. The cleaning medium comprises a coupling element that is dispersed inside the suspension is applied over the wafer surface. External energy is applied to the cleaning medium periodically to generate a shear stress on the internal medium. By cyclic shear stress is given the momentum and / or drag force on the coupling element, the coupling element to remove particulate contamination from the wafer surface to interact with the particulate contaminants. ; cleaning solution, periodic shear, wafer cleaning