THERMOSETTING RESIN COMPOSITION WITH LOW PERMITTIVITY, LOW LOSS, AND A LOW THERMAL EXPANSION COEFFICIENT IN A HIGH FREQUENCY BAND AND A PRINTED CIRCUIT BOARD THEREOF

摘要

PURPOSE: A thermosetting resin composition is provided to ensure low permittivity, low loss, and a low thermal expansion coefficient in a high frequency band by mixing cyclo olefin polymers with a cross-linking agent and initiator.;CONSTITUTION: A thermosetting resin composition comprises: a base resin consisting of solid-phase cyclo olefin homopolymers; an organic solvent for dissolving the base resin; a cross-linking agent of 5-20% weight based on the base resin; an initiator actuating a reaction catalyst of the cross-linking agent; and silica raw materials. The thermal expansion coefficient of the resin composition lowers by blending the silica raw materials.;COPYRIGHT KIPO 2010