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机译:热稳定,低损耗的光学有机硅:电光印刷电路板的关键推动力
Dow Corning Corp., Midland, MI, USA;
electro-optical devices; optical interconnections; optical losses; optical polymers; optical waveguides; printed circuits; silicones; thermal stability; IPC shock test; PCB integration; electro-optical printed circuit boards; harsh reliability; lamination; low loss optical silicones; momechanical properties; multimode polymer waveguides; plating; polysiloxane back- bone; residual stress; solder bath; solder reflow; temperature 25 degC to 288 degC; thermally stable optical silicones; through-hole via drilling; waveguide fabrication; wavelength 850 nm; Optical device fabrication; Optical interconnections; Optical polymers; Optical waveguides; Stress; Electro-optical printed circuit boards (EOCBs); multimode waveguides; optical interconnects; optical silicones; polysiloxanes;
机译:基于电光印刷电路板的未对准相对功率损耗
机译:FirstLight:用于数据中心中的聚合物电光印刷电路板的可插拔光互连技术
机译:基于电光印刷电路板的光波导45°耦合结构性能分析
机译:使用光学纤维嵌入的环氧树脂基质的热稳定且低损耗的光波导,用于光学印刷电路板应用
机译:研究表面安装技术烤箱内回流过程中印刷电路板的热行为
机译:氟化聚合物稳定作用可增强稳定的立方软上部结构的低温电光Kerr效应
机译:用于光学印刷电路板的低损耗3维变频分型聚合物光学波导