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SURFACE PROCESSING METHOD OF A PCB RESIN, CAPABLE OF FORMING A MINUTE CIRCUIT PATTERN AND A PCB RESIN THEREOF

机译:能够形成微小电路图案的PCB树脂的表面处理方法及其PCB树脂

摘要

PURPOSE: A surface processing method of a PCB resin and a PCB resin thereof are provided to improve an adhesive force between a PCB resin and a metallic ink by roughening the surface of the PCB resin.;CONSTITUTION: A PCB resin is provided(S101). Peaks and valleys are formed by roughening the surface of the PCB resin(S102). A filler is filled with a valley(S103). A coating layer is formed by coating a liquid repellent material in the surface of the PCB resin(S104). The filler filled in the valley and the coating layer corresponding to the filler are removed(S105).;COPYRIGHT KIPO 2010
机译:用途:提供一种PCB树脂及其表面树脂的表面处理方法,以通过使PCB树脂的表面变粗糙来提高PCB树脂与金属油墨之间的粘合力。;组成:提供一种PCB树脂(S101) 。通过粗糙化PCB树脂的表面来形成峰和谷(S102)。用谷填充填充物(S103)。通过在PCB树脂的表面上涂覆疏液材料来形成涂层(S104)。谷底填充物和与填充物相对应的涂层被去除(S105)。; COPYRIGHT KIPO 2010

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