首页> 外国专利> METHOD FOR SELECTIVELY ETCHING A SEMICONDUCTOR REGION AND THE METHOD FOR SEPARATING A SEMICONDUCTOR DEVICE FROM A SUBSTRATE, CAPABLE OF TRANSFERRING A SEMICONDUCTOR STRUCTURE TO OTHER SUBSTRATE BY EASILY SEPARATING THE SEMICONDUCTOR STRUCTURE GROWN ON THE SUBSTRATE

METHOD FOR SELECTIVELY ETCHING A SEMICONDUCTOR REGION AND THE METHOD FOR SEPARATING A SEMICONDUCTOR DEVICE FROM A SUBSTRATE, CAPABLE OF TRANSFERRING A SEMICONDUCTOR STRUCTURE TO OTHER SUBSTRATE BY EASILY SEPARATING THE SEMICONDUCTOR STRUCTURE GROWN ON THE SUBSTRATE

机译:有选择地蚀刻半导体区域的方法和将半导体设备从基质分离的方法,该基质可以通过容易地将生长在基质上的半导体结构分离而将半导体结构转移到其他基质

摘要

PURPOSE: A method for selectively etching a semiconductor region and the method for separating a semiconductor device from a substrate are provided to discharge heat through a metal substrate by growing an optical element on a sapphire substrate and transferring the optical element to the metal substrate with high thermal conductivity.;CONSTITUTION: A n-GaN based first semiconductor region(120) and a n-GaN based second semiconductor region(240) are prepared on a substrate. An electrolyte etching process is performed using the first semiconductor region and the second semiconductor region as an anode and an electrolyte as a cathode. An etching speed is differently controlled by controlling the doping density on the first and second semiconductor regions.;COPYRIGHT KIPO 2010
机译:用途:提供一种选择性刻蚀半导体区域的方法和一种将半导体器件与基板分离的方法,以通过在蓝宝石基板上生长光学元件并将光学元件以较高的温度传输至金属基板,从而通过金属基板释放热量。组成:在衬底上制备基于n-GaN的第一半导体区域(120)和基于n-GaN的第二半导体区域(240)。使用第一半导体区域和第二半导体区域作为阳极并且使用电解质作为阴极来执行电解质蚀刻工艺。通过控制第一半导体区域和第二半导体区域上的掺杂密度来不同地控制蚀刻速度。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100038539A

    专利类型

  • 公开/公告日2010-04-15

    原文格式PDF

  • 申请/专利号KR20080097552

  • 发明设计人 RYU SANG WAN;

    申请日2008-10-06

  • 分类号H01L33/12;H01L21/3063;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:00

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