DIE BONDING METHOD FOR A SEMICONDUCTOR PACKAGE PROCESS, CAPABLE OF IMPROVING PROCESS EFFICIENCY BY REDUCING THE NUMBER OF PROCESSES OF MOVING AND ATTACHING A DIE BONDING HEAD

摘要

PURPOSE: A die bonding method for a semiconductor package process is provided to improve productivity by increasing the number of die bonding processes per unit time.;CONSTITUTION: A wafer which is completely sawed is loaded on a die bonding device(S100). The die bonding device loads a basic frame of the semiconductor package(S200). At least two semiconductor chips are picked up from the water in the die bonding device(S300). Two picked semiconductor chips or more are boned with a chip bonding unit of the basic frame(S400).;COPYRIGHT KIPO 2010