APPARATUS AND A METHOD FOR BONDING DIES, CAPABLE OF IMPROVING THE EFFICIENCY OF A DIE BONDING PROCESS

摘要

PURPOSE: An apparatus and a method for bonding dies are provided to improve the efficiency of a die bonding process by checking whether the other die is transferred or not by the second bonding head and securing a position of a die and the second bonding head when one die is transferred and is pressurized by the first bonding head.;CONSTITUTION: In an apparatus and a method for bonding dies, a wafer stage(110) supports a wafer including a plurality of dies. A die transfer(130) picks dies up one by one from the wafer and transfers it. A die bonding head(150) bonds the dies transferred by the die transfer on a substrate alternately. A vision camera(160) confirms a position of die held by die bonding head.;COPYRIGHT KIPO 2010