DIE BONDER PROVIDING LARGE BONDING FORCE, CAPABLE OF ACCURATELY BONDING DIES BY REDUCING THE PLACEMENT ERROR OF A BONDING HEAD

摘要

PURPOSE: A die bonder providing large bonding force is provided to correct the unpredicted rotational offset of dies by compensating the rotation or theta of a bonding head.;CONSTITUTION: A bonding head(12) includes a collet(30) in order to bond a die to a bonding position. A first motor(14) is in connection with the collet using a shaft(34). A second motor(19) is in connection with the bonding head in order to drive the bonding head. The first motor and the second motor are mounted to a supporting structure(36). A rotary motor(32) is in connection with the collet in order to rotate the collect around a rotary shaft which is in parallel with the driving direction of the first motor.;COPYRIGHT KIPO 2011