METHOD FOR FORMING THE SOLDER RESIST PATTERN OF A PRINTED CIRCUIT BOARD, BY RADIATING LASER WITH A LASER DIRECTING IMAGING METHOD

摘要

PURPOSE: A method for forming the solder resist pattern of a printed circuit board is provided to reduce the manufacturing cost and read time by selectively radiating laser to a desired part based on a pre-set data.;CONSTITUTION: A pre-processing operation for a substrate is performed(S201). A first solder resist is applied on the substrate(S202). A pseudo-hardening process is performed for the first solder resist(S203). A second solder resist is applied(S204). A pseudo-hardening process is performed for the second solder resist(S205). The solder resists are exposed with a laser directing imaging method. The development process for the solder resists is performed(S207). The solder resist is hardened by ultra violet ray(S208).;COPYRIGHT KIPO 2010