SEMICONDUCTOR PACKAGE HAVING A SOLDER BUMP AND A METHOD OF MANUFACTURING THE SAME, CAPABLE OF RELIEVING STRESS WHICH IS CONCENTRATED ON THE PUMP IN FORMING A BUMP AND PACKAGE INTERCONNECTION

摘要

PURPOSE: A semiconductor package having a solder bump and a method of manufacturing the same are provided to secure the junction reliability of a semiconductor package such as a flip chip and WLCSP(Wafer Level Chip Scale Package) while removing a process of forming a stress layer.;CONSTITUTION: A semiconductor substrate(110) comprises a connection unit(111). A printed circuit board(120) comprises an outer connection pad(121). A solder bump(130) is interposed between a connection unit of a semiconductor and an external connection pad of the printed circuit board and it bonded with them. A stress relaxing layer(140) includes a polymer while surrounding a solder pump, a connection unit, and outside of an external connection pad.;COPYRIGHT KIPO 2010