ADHESIVE LAYER FORMING SOLUTION CAPABLE OF SUPPLYING A WIRING SUBSTRATE WITH HIGH RELIABILITY, AND A FORMATION METHOD OF AN ADHESIVE LAYER

摘要

PURPOSE: An adhesive layer forming solution and a formation method of an adhesive layer are provided to maintain a formation efficiency of the adhesive layer, and to secure the adhesion force with a resin.;CONSTITUTION: An adhesive layer forming solution for attaching copper with a resin is an aqueous solution containing acid, first stannous salt, second stannous salt, a complexing agent and a stabilizer. The formation method of the adhesive layer for attaching the copper with the resin comprises a step of treating the surface of the copper with the adhesive layer forming solution.;COPYRIGHT KIPO 2010