ADHESIVE LAYER-FORMING SOLUTION CAPABLE OF PROVIDING A WIRING BOARD WITH HIGH RELIABILITY'

摘要

PURPOSE: An adhesive layer-forming solution is provided to suppress the time-course deterioration of formation performance of an adhesive layer and to secure the smoothness on the surface of the adhesion layer.;CONSTITUTION: An adhesive layer-forming solution for forming an adhesive layer for bonding copper and resin is the solution including an acid, second stannic salt, complexing agent, stabilizer, and a complexation inhibitor for inhibiting complexation of the copper and complexing agent. The complexation inhibitor is at least one selected from phosphoric acids, phosphorous acids and hypophosphorous acid.;COPYRIGHT KIPO 2010