PRINTED CIRCUIT BOARD AND A MANUFACTURING METHOD THEREOF, CAPABLE OF PROVIDING A SUBSTRATE WITH HIGH RELIABILITY

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce defects that locations of a bump layer and an electrode unit are wrong.;CONSTITUTION: A substrate(110) includes an electrode unit formed on a surface of a printed circuit board. An opening is formed on a solder resist layer(120) to expose the electrode unit to the outside. A bump layer(130) includes the same diameter as the diameter of the opening and electrically connects external chip components.;COPYRIGHT KIPO 2011