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METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, CAPABLE OF PERFORMING FIRST AND SECOND PLASMA PROCESSES IN THE SAME CHAMBER WITH IN-SITU
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, CAPABLE OF PERFORMING FIRST AND SECOND PLASMA PROCESSES IN THE SAME CHAMBER WITH IN-SITU
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机译:制造半导体装置的方法,该装置能够在原位在同一腔室中执行第一和第二等离子体过程
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摘要
PURPOSE: A method for manufacturing a semiconductor device is provided to prevent the decrease of nitrogen density in a nitrified gate insulation layer by removing a nitrogen element with an unstable coupling state inside the nitrified gate insulation layer.;CONSTITUTION: A gate insulation layer is formed on a substrate(11). Nitrogen layer is implanted into a gate insulation layer(12B). A nitrogen element with an unstable coupling state is removed inside a gate insulation layer in the same chamber. A gate electrode is formed on the gate insulation layer.;COPYRIGHT KIPO 2010
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