首页> 外国专利> MANUFACTURING METHOD OF A VERTICAL STRUCTURE GALLIUM NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DEVICE FOR FORMING A SINGLE CRYSTAL GROWTH LAYER OF A HIGH GRADE WITHOUT A GROWTH OF A BUFFER LAYER

MANUFACTURING METHOD OF A VERTICAL STRUCTURE GALLIUM NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DEVICE FOR FORMING A SINGLE CRYSTAL GROWTH LAYER OF A HIGH GRADE WITHOUT A GROWTH OF A BUFFER LAYER

机译:垂直结构的氮化镓基半导体发光器件的制造方法,用于形成不具有缓冲层生长的高梯度单晶生长层

摘要

PURPOSE: A manufacturing method of a vertical structure gallium nitride based semiconductor light emitting device is provided to control a crystal defect of the light emitting device by easily separating a growth substrate from a light emitting structure using a wet-chemically etching.;CONSTITUTION: A sacrificial layer is formed on the single-side of a gallium nitride-based semiconductor substrate. An ion implantation region(130) by the ion implantation is formed on the single-side of the gallium nitride-based semiconductor substrate. A light emitting structure(160) including sequentially laminated a first conductive type nitride layer(161), an active layer(163) and a second conductive type nitride(165) are formed on the ion implantation region. A metal layer(170) for a first junction is formed on the second conductive type nitride layer. A support substrate formed the metal layer for a second junction is welded on the metal layer for the first junction. The growth substrate is separated from the light emitting structure with etching the sacrificial layer.;COPYRIGHT KIPO 2010
机译:目的:提供一种垂直结构的氮化镓基半导体发光器件的制造方法,以通过使用湿化学蚀刻容易地将生长衬底与发光结构分离来控制发光器件的晶体缺陷。在氮化镓基半导体衬底的单侧上形成牺牲层。通过离子注入的离子注入区域(130)形成在氮化镓基半导体衬底的单侧上。在离子注入区域上形成包括依次层叠的第一导电型氮化物层(161),有源层(163)和第二导电型氮化物(165)的发光结构(160)。在第二导电型氮化物层上形成用于第一结的金属层(170)。形成用于第二结的金属层的支撑基板被焊接在用于第一结的金属层上。通过蚀刻牺牲层将生长衬底与发光结构分离。; COPYRIGHT KIPO 2010

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