PRINTED CIRCUIT BOARD COMPRISING A METAL BUMP AND A METHOD OF MANUFACTURING THE SAME, CAPABLE OF PREVENTING A VOID GENERATED IN AN UNDER-FILL PROCESS

摘要

PURPOSE: A printed circuit board comprising a metal bump and a method of manufacturing the same are provided to enhance electric connection to electronic components by including a metal bump with excellent electrical conduction.;CONSTITUTION: A metal bump(900) is projected to an upper part of an insulating layer(300). The metal bump has a fixed diameter. A circuit layer(530) is formed into a lower part of the insulating layer. A via(510) passes through the insulating layer. The via electrically connects to the metal bump and the circuit layer.;COPYRIGHT KIPO 2010