JIG FOR ELIMINATING VOIDS AND A METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD USING A VOID ELIMINATING PIN, CAPABLE OF ELIMINATING VOIDS GENERATED FROM VIA-HOLE FILLED FILLER

摘要

PURPOSE: A jig for eliminated voids and a method for manufacturing a printed circuit board using a void eliminating pin are provided to improve the contact reliability of vias formed in an inner layer and an outer layer by preventing a groove part from being formed at the center part of a via-hole.;CONSTITUTION: A base substrate(100) with a via-hole is prepared. Filler fills the inside of the via-hole. A void eliminating pin(310) is inserted in the via-hole. The void eliminating pin is eliminated from the base substrate. The base substrate includes a first metal layer which is formed in the inner wall of the via-hole. Protruded filler(110) is eliminated from the outer side of the base substrate. A second metal layer is formed on the outer side of the base substrate. An additional insulating layer is stacked on the outer side of the base substrate. Another via-hole is formed on the additional insulating layer. A via is formed in the via-hole in the additional insulating layer.;COPYRIGHT KIPO 2011