MULTI-LAYERED PRINTED CIRCUIT BOARD AND A MANUFACTURING METHOD THEREOF, CAPABLE OF PREVENTING GENERATION OF VOID AND ACHIEVING THIN FILM MANUFACTURING

摘要

PURPOSE: A multi-layered printed circuit board and a manufacturing method thereof are provided to prevent generation of void as being able to be manufactured in thin thickness.;CONSTITUTION: A multi-layered printed circuit board includes an insulating layer(120), an inner layer pad(131), an inner layer circuit line(133), a via(163) and an outer layer circuit line(165). The insulating layer is formed by dipping a fiber to an epoxy. The inner layer pad and the inner layer circuit line are arranged in the insulating layer. Thickness(H2) of the inner layer circuit line is thinner than thickness(H1) of the inner layer pad. The via passes through the insulating layer and is connected to the inner layer pad. The outer layer circuit line is formed on the outer surface of the insulating layer, by performing plating on a via hole(151) and the insulating layer and then etching a plated layer.;COPYRIGHT KIPO 2013