PRINTED CIRCUIT BOARD CAPABLE OF PREVENTING A BUMP DEFECT RISK IN A MANUFACTURING PROCESS AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce manufacturing costs and lead time by omitting a solder coining process and a solder reflow process using solder paste.;CONSTITUTION: A base substrate is prepared. A circuit layer(130) is formed on the base substrate. A bump(150) is formed by plating to surround a circuit pattern of the circuit layer. A solder resist layer(160) with an open part is formed on the base substrate.;COPYRIGHT KIPO 2013