Shorter circuit: The horizontal 'Graphite 2000' process is shorter than the electroless copper processes used in the manufacture of some printed circuit boards

首页> 外文期刊>Product Finishing >Shorter circuit: The horizontal 'Graphite 2000' process is shorter than the electroless copper processes used in the manufacture of some printed circuit boards

【24h】

Shorter circuit: The horizontal 'Graphite 2000' process is shorter than the electroless copper processes used in the manufacture of some printed circuit boards

机译：电路更短：水平的“ Graphite 2000”工艺比某些印刷电路板制造中使用的化学镀铜工艺更短

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

著录项
相似文献
相关主题

著录项

来源
《Product Finishing》 |1998年第10期|共1页
作者

展开▼
作者单位

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类金属腐蚀与保护、金属表面处理;
关键词

相似文献

外文文献
中文文献
专利

1. Shorter circuit: The horizontal 'Graphite 2000' process is shorter than the electroless copper processes used in the manufacture of some printed circuit boards [J] . Product Finishing . 1998,第10期

机译：电路更短：水平的“ Graphite 2000”工艺比某些印刷电路板制造中使用的化学镀铜工艺更短
2. Identification and chemical characterization of particulate matter from wave soldering processes at a printed circuit board manufacturing company [J] . Z. Szoboszlai, Zs. Kertesz, Z. Szikszai, Journal of Hazardous Materials . 2012,第期

机译：印刷电路板制造公司中波峰焊过程中颗粒物质的识别和化学表征
3. Plasma Processes FOR PRINTED CIRCUIT BOARD MANUFACTURING [J] . Lou Fierro, James D. Getty Circuitree . 2003,第3期

机译：印刷电路板制造的等离子工艺
4. Short-Term Evaluation of Dry Electrodes Fabricated using Flexible Printed Circuits Processes for Bioimpedance Measurements [C] . Shelby Critcher, Todd J. Freeborn IEEE South East Conference . 2020

机译：短期评估使用柔性印刷电路板工艺制造的干电极的生物阻抗测量
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers [O] . Pan Yi, Kui Xiao, Kangkang Ding, 2017

机译：薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
7. Electroless copper plating by applying electrolysis. Application for a printed circuit board manufacturing process. [O] . Hideo HONMA, Tomoyuki FUJINAMI, Hiroaki TAKAGI 1990

机译：施加电解镀铜电镀。应用于印刷电路板制造过程。
8. Prototype and Short-Run Printed Circuit Board Creation [R] . Hoelder, D. 1993

机译：原型和短版印刷电路板的创建

Shorter circuit: The horizontal 'Graphite 2000' process is shorter than the electroless copper processes used in the manufacture of some printed circuit boards

著录项

相似文献

相关主题

期刊订阅