SURFACE MOUNTED DEVICE PACKAGE AND A MANUFACTURING METHOD THEREOF, CAPABLE OF MINIMIZING A SPACE FOR APPLYING THE SURFACE MOUNTED DEVICE PACKAGE

摘要

PURPOSE: A surface mounted device package and a manufacturing method thereof are provided to efficiently use a space by minimizing the space for applying the surface mounted device package without changing the inner configuration of the surface mounted device package.;CONSTITUTION: A cavity(C) is formed on a substrate(110). A signal line(140) is formed inside the substrate. A surface mounted device(120) is positioned inside the cavity and is mounted on the bottom of the cavity through an inner terminal electrode(150). An outer terminal electrode(130) is formed on the side of the substrate and electrically connects the substrate and the surface mounted device.;COPYRIGHT KIPO 2010