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BACKING PLATE AND A SPUTTERING TARGET USING THE SAME, CAPABLE OF IMPROVING UTILIZATION RATIO BY ELIMINATING THE HEIGHT DIFFERENCE OF SPUTTERING TARGETS WHOSE THICKNESSES ARE DIFFERENT
BACKING PLATE AND A SPUTTERING TARGET USING THE SAME, CAPABLE OF IMPROVING UTILIZATION RATIO BY ELIMINATING THE HEIGHT DIFFERENCE OF SPUTTERING TARGETS WHOSE THICKNESSES ARE DIFFERENT
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机译:使用相同厚度的背板和溅射靶材,可以消除厚度不同的溅射靶材的高度差异,从而提高利用率
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摘要
PURPOSE: A backing plate and a sputtering target using the same are provided to eliminate the height difference of a first sputtering target and a second sputtering target by using a thickness reinforcing member and to reduce fault y improving a deposition condition.;CONSTITUTION: A backing plate comprises a plate part which comprises a first surface part wherein a first sputtering target(22a,22b) is loaded and a second surface part wherein a surface in order that a second sputtering target is settled is protruded, a thickness reinforcing member which eliminates the height difference of the first sputtering target and the second sputtering target and is formed with the same material as the plate part or the metal plate in which the thermal conductivity is similar, and a bonding member which adheres the thickness reinforcing member and plate part.;COPYRIGHT KIPO 2010
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