首页> 外国专利> BACKING PLATE AND A SPUTTERING TARGET USING THE SAME, CAPABLE OF IMPROVING UTILIZATION RATIO BY ELIMINATING THE HEIGHT DIFFERENCE OF SPUTTERING TARGETS WHOSE THICKNESSES ARE DIFFERENT

BACKING PLATE AND A SPUTTERING TARGET USING THE SAME, CAPABLE OF IMPROVING UTILIZATION RATIO BY ELIMINATING THE HEIGHT DIFFERENCE OF SPUTTERING TARGETS WHOSE THICKNESSES ARE DIFFERENT

机译:使用相同厚度的背板和溅射靶材,可以消除厚度不同的溅射靶材的高度差异,从而提高利用率

摘要

PURPOSE: A backing plate and a sputtering target using the same are provided to eliminate the height difference of a first sputtering target and a second sputtering target by using a thickness reinforcing member and to reduce fault y improving a deposition condition.;CONSTITUTION: A backing plate comprises a plate part which comprises a first surface part wherein a first sputtering target(22a,22b) is loaded and a second surface part wherein a surface in order that a second sputtering target is settled is protruded, a thickness reinforcing member which eliminates the height difference of the first sputtering target and the second sputtering target and is formed with the same material as the plate part or the metal plate in which the thermal conductivity is similar, and a bonding member which adheres the thickness reinforcing member and plate part.;COPYRIGHT KIPO 2010
机译:目的:提供一种背板和使用该背板的溅射靶,以通过使用厚度增强构件消除第一溅射靶和第二溅射靶的高度差并减少改善沉积条件的缺陷。该板包括板部分,该板部分包括第一表面部分和第二表面部分,该第一表面部分中装载有第一溅射靶(22a,22b),该第二表面部分中突出有用于沉积第二溅射靶的表面,该厚度增强件消除了第一溅射靶和第二溅射靶的高度差由与导热率相似的板部或金属板相同的材料形成,并具有使厚度增强构件和板部粘合的接合构件。版权所有KIPO 2010

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