CMP SLURRY INJECTION METHOD, WHICH CAN REDUCE SLURRY WASTE BY MAINTAINING AN OPTIMUM REMOVAL RATE

摘要

PURPOSE: A CMP slurry injection method is provided to increase the uniformity of a removal rate at the surface of a wafer and to reduce slurry waste.;CONSTITUTION: A CMP slurry injection method is as follows. A concave trailing edge(12) of a solid crescent-shape injector(10) is made in the leading edge of a grinding head with a 0~3 inch gap(42). The CMP slurry or the components flow through one or more openings of the upper end of the solid crescent-shape injector. The CMP slurry or the components are carried to a bottom part through a channel or a reservoir according to the length of a device(19).;COPYRIGHT KIPO 2011