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APPARATUS FOR TREATING CMP SLURRY WASTE LIQUID AND METHOD OF TREATING CMP SLURRY WASTE LIQUID

机译:CMP浆液的处理装置及CMP浆液的处理方法

摘要

PPROBLEM TO BE SOLVED: To provide an apparatus for treating CMP slurry waste liquid and a method of treating CMP slurry waste liquid which can be compactly configured and can clear the wastewater standard at a low cost. PSOLUTION: By using the apparatus 1 for treating CMP slurry waste liquid, a solid material-removing process for removing solid material with a special filter 2, a COD adsorption process for adsorbing and removing a surfactant and organic material which raises COD with activated carbon, by using a COD adsorption tower 3 and a Cu ion-removing process for removing Cu ions by using a Cu-removing ion exchange resin tower 4 are continuously performed by means of a slurry waste liquid flow path 5. Therein, on the upper stream side than the Cu ion-removing process, the solid material-removing process and the COD adsorption process are performed and, thereby, only CMP slurry waste liquid is continuously and individually treated by the slurry waste liquid flow path 5. PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:提供一种用于处理CMP浆料废液的设备和一种用于处理CMP浆料废液的方法,其可以紧凑地构造并且可以低成本地清除废水标准。

解决方案:通过使用用于处理CMP浆料废液的设备1,使用专用过滤器2去除固体材料的固体材料去除工艺,用于吸附和去除表面活性剂的COD吸附工艺以及可提高COD的有机材料的方法。通过使用COD吸附塔3的活性炭和通过使用Cu去除离子交换树脂塔4去除Cu离子的Cu离子去除工艺通过浆料废液流路5连续进行。在比Cu离子去除工序更靠上游侧的位置上,通过进行固体物质去除工序和COD吸附工序,从而仅CMPCMP浆料废液在浆料废液流路5中被连续且单独地处理。版权所有:(C)2011,日本特许厅和INPIT

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