SLURRY SUPPLY APPARATUS OF CMP EQUIPMENT AND METHOD FOR CLEANING SLURRY SUPPLY PIPE TO INCREASE OPERATION RATE OF CMP EQUIPMENT AND AVOID MICRO SCRATCH ON WAFER IN CMP PROCESS

摘要

PURPOSE: A slurry supply apparatus of CMP(chemical mechanical polishing) equipment is provided to increase an operation rate of CMP equipment and avoid a micro scratch on a wafer in a CMP process by supplying slurry through one slurry supply pipe and by circulating a strong alkaline potassium hydroxide solution capable of dissolving solid state slurry through the other slurry supply pipe. CONSTITUTION: A slurry tank(210) mixes and supplies slurry. The first slurry supply pipe(230) supplies slurry to a polishing pad(200) of CMP equipment, connected to the slurry tank. The second slurry supply pipe(240) supplies slurry to the polishing pad of the CMP equipment, connected to the first slurry supply pipe. A potassium hydroxide tank(250) includes a potassium hydroxide supply pipe(260) connected to the first and second slurry supply pipes. A three-directional valve(270) can selectively supply potassium hydroxide to the first and second slurry supply pipe and can selectively supply slurry from the first and second slurry supply pipes to the polishing pad of the CMP equipment, installed in the potassium hydroxide supply pipe and the first and second slurry supply pipes.