首页> 外国专利> ZIRCONIA THIN FILM DEPOSITION METHOD WHICH IMPROVES THE THIN FILM PROPERTY BY ADJUSTING THE VOLUME RATIO OF OXYGEN GAS TO NITROGEN GAS

ZIRCONIA THIN FILM DEPOSITION METHOD WHICH IMPROVES THE THIN FILM PROPERTY BY ADJUSTING THE VOLUME RATIO OF OXYGEN GAS TO NITROGEN GAS

机译:通过调整氧气与氮气的体积比来改善薄膜性能的氧化锆薄膜沉积方法

摘要

PURPOSE: A zirconia thin film deposition method is provided to be used for dielectric layer of a semiconductor and an active layer of a display by improving the dielectric constant and refractive index by adjusting the volume ratio of oxygen gas to the nitrogen gas which are injected into a chamber.;CONSTITUTION: A board heating heater(13), a substrate holder(7), a shutter(11), and a zirconium target(3) are installed in the pre-processing of zirconia thin film deposition. A substrate(10) is cleansed with the nitrogen gas after cleansing with deionized water after cleansing in the ultrasonic cleaner for 15 minutes by using the ethanol in order to eliminate the organic and the inorganic substance present on the surface of substrate.;COPYRIGHT KIPO 2011
机译:目的:提供一种氧化锆薄膜沉积方法,该方法用于通过调节注入的氧气与氮气的体积比来提高介电常数和折射率,从而用于半导体的介电层和显示器的有源层组成:在氧化锆薄膜沉积的预处理过程中,安装了板式加热加热器(13),基板支架(7),挡板(11)和锆靶(3)。为了消除存在于基板表面的有机物和无机物,在超声波清洗器中用乙醇清洗15分钟后,用去离子水清洗后用氮气清洗基板(10)。COPYRIGHTKIPO 2011

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