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Physical vapor deposition and metalorganic chemical vapor deposition of yttria-stabilized zirconia thin films.

机译:氧化钇稳定的氧化锆薄膜的物理气相沉积和金属有机化学气相沉积。

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摘要

Two vapor deposition techniques, dual magnetron oblique sputtering (DMOS) and metalorganic chemical vapor deposition (MOCVD), have been developed to produce yttria-stabilized zirconia (YSZ) films with unique microstructures. In particular, biaxially textured thin films on amorphous substrates and dense thin films on porous substrates have been fabricated by DMOS and MOCVD, respectively.;DMOS YSZ thin films were deposited by reactive sputtering onto Si (native oxide surface) substrates positioned equidistant between two magnetron sources such that the fluxes arrived at oblique angles with respect to the substrate normal. Incident fluxes from two complimentary oblique directions were necessary for the development of biaxial texture. The films displayed a strong [001] out-of-plane orientation with the ⟨110⟩ direction in the film aligned with the incident flux. Biaxial texture improved with increasing oblique angle and film thickness, and was stronger for films deposited with Ne than with Ar. The films displayed a columnar microstructure with grain bundling perpendicular to the projected flux direction, the degree of which increased with oblique angle and thickness. The texture decreased by sputtering at pressures at which the flux of sputtered atoms was thermalized. These results suggested that grain alignment is due to directed impingement of both sputtered atoms and reflected energetic neutrals. The best texture, a {111} phi FWHM of 23°, was obtained in a 4.8 mum thick film deposited at an oblique angle of 56°.;MOCVD YSZ thin films were deposited in a vertical cold-wall reactor using Zr(tmhd)4 and Y(tmhd)3 precursors. Fully stabilized YSZ films with 9 mol% could be deposited by controlling the bubbler temperatures. YSZ films on Si substrates displayed a transition at 525°C from surface kinetic limited growth, with an activation energy of 5.5 kJ/mole, to mass transport limited growth. Modifying the reactor by lowering the inlet height and introducing an Ar baffle ring increased the growth rates to 2.5 mum/hr. Dense, gas impermeable 4--6 mum YSZ thin films were deposited on porous (La,Sr)Mno3 cathode substrates. Solid oxide fuel cells, fabricated by sputtering on a Ni-YSZ anode, achieved open circuit voltages ≥94% theoretical, and maximum power densities at 750°C comparable with commercial conventional SOFC's operated at higher temperatures.
机译:已经开发了两种气相沉积技术,即双磁控倾斜溅射(DMOS)和金属有机化学气相沉积(MOCVD),以生产具有独特微观结构的氧化钇稳定的氧化锆(YSZ)膜。具体而言,分别通过DMOS和MOCVD制备了非晶态衬底上的双轴织构薄膜和多孔衬底上的致密薄膜。通过反应溅射将DMOS YSZ薄膜沉积在两个磁控管之间等距的Si(天然氧化物表面)衬底上光源使通量相对于基板法线成斜角到达。来自两个互补的倾斜方向的入射通量对于发展双轴织构是必要的。薄膜显示出很强的[001]面外取向,且薄膜中的〈110〉方向与入射通量对齐。双轴织构随倾斜角和膜厚的增加而改善,并且与Ne相比,Ne沉积的膜的双轴织构更强。薄膜显示出圆柱状的微观结构,晶粒垂直于投影的通量方向成束,其程度随倾斜角和厚度的增加而增加。通过在溅射原子的通量被热化的压力下进行溅射,织构降低。这些结果表明,晶粒取向是由于溅射原子和反射的高能中性粒子的定向撞击造成的。最佳质地为{111} phi FWHM为23°,这是在以56°倾斜角沉积的4.8 um厚膜中获得的。MOCVDYSZ薄膜使用Zr(tmhd)在垂直冷壁反应器中沉积4和Y(tmhd)3前体。可以通过控制起泡器温度来沉积具有9 mol%的完全稳定的YSZ膜。 Si衬底上的YSZ膜在525°C下显示出从表面动力学受限的生长(具有5.5 kJ / mol的活化能)到质量传输受限的生长的过渡。通过降低进口高度和引入Ar挡板环来改造反应器,可将生长速率提高到2.5 mum / hr。将致密,不透气的4--6微米YSZ薄膜沉积在多孔(La,Sr)Mno3阴极基板上。通过在Ni-YSZ阳极上进行溅射制造的固体氧化物燃料电池,其理论开路电压≥94%,并且在750°C时的最大功率密度可与在高温下运行的常规SOFC相比。

著录项

  • 作者

    Kaufman, David Y.;

  • 作者单位

    Northwestern University.;

  • 授予单位 Northwestern University.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 1998
  • 页码 149 p.
  • 总页数 149
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:48:39

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