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Group III nitride semiconductor crystal growing method, group III nitride semiconductor crystal substrate fabrication method, and group III nitride semiconductor crystal substrate

机译:III族氮化物半导体晶体生长方法,III族氮化物半导体晶体衬底制造方法和III族氮化物半导体晶体衬底

摘要

1. A method of growing III nitride semiconductor crystal group, comprising the following steps: preparation of the substrate and the bottom! growing a first III nitride semiconductor crystal groups doped with silicon by using silicon tetrachloride gas as doping gas, on said lower substrate cultivation of vapor! wherein the growth rate of said first semiconductor chip group III nitride is at least 200 m / h and not more than 2000 microns / hr. ! 2. A method of growing the nitride semiconductor crystal Group III of claim 1, wherein said growing step includes the step of growing said first semiconductor crystal Group III nitride hydride vapor phase epitaxy. ! 3. A method of growing the nitride semiconductor crystal Group III of claim 2, wherein said growing step includes the step of growing said first semiconductor crystal Group III nitride at a temperature of at least 1050 ° C and not more than 1300 ° C. ! 4. A method of growing the nitride semiconductor crystal Group III of claim 1, wherein said growing step includes the step of supplying said doping gas to said lower substrate such that the concentration of said silicon in said first group III nitride semiconductor crystal is at least 5 × 1016 cm-3 and not more than 5 × 1020 cm-3. ! 5. A method of growing the nitride semiconductor crystal Group III according to claim 4, wherein said growing step includes the step of supplying said doping gas to said lower substrate such that the concentration
机译:1.一种生长III族氮化物半导体晶体群的方法,包括以下步骤:制备衬底和底部!通过使用四氯化硅气体作为掺杂气体来生长掺杂有硅的第一III族氮化物半导体晶体组,在所述下层衬底上形成蒸气!其中所述第一半导体芯片III族氮化物的生长速率为至少200m / h且不大于2000微米/小时。 ! 2.根据权利要求1所述的生长氮化物半导体晶体III族的方法,其中,所述生长步骤包括生长所述第一半导体晶体III族氮化物氢化物气相外延的步骤。 ! 3.根据权利要求2所述的生长氮化物半导体晶体III族的方法,其中,所述生长步骤包括在至少1050℃且不超过1300℃的温度下生长所述第一半导体晶体III族氮化物的步骤。 4.根据权利要求1所述的生长氮化物半导体晶体III的方法,其中所述生长步骤包括将所述掺杂气体供应到所述下基板的步骤,使得所述第一III族氮化物半导体晶体中的所述硅的浓度至少为1。 5×1016 cm-3,但不超过5×1020 cm-3。 ! 5.根据权利要求4所述的生长氮化物半导体晶体III族的方法,其中所述生长步骤包括将所述掺杂气体供应到所述下基板以使得其浓度

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